Products
  • CMP Lapping Machine
  • CMP Lapping Machine
  • CMP Lapping Machine
  • CMP Lapping Machine
  • CMP Lapping Machine
  • CMP Lapping Machine
  • CMP Lapping Machine
  • CMP Lapping Machine
  • CMP Lapping Machine
  • CMP Lapping Machine
  • CMP Lapping Machine
  • CMP Lapping Machine
  • CMP Lapping Machine
  • CMP Lapping Machine
CMP Lapping Machine

Application Scope:

This equipment is mainly used for single-sided precision grinding of sapphire substrate, sapphire epitaxial wafer, Si, ceramic wafer, quartz crystal, SiC, Ge and other semiconductor materials.

Product Details
Equipment Features::

1. This is a single-side precision Lapping Machine. It adopts advanced mechanical structure and control method, and has high polishing efficiency and stable operation.

2. The whole machine adopts PLC+touch screen control system, Equipment parameters can be set here, which is easy to operate.

3. The main motor adopts variable frequency speed control to realize the soft start and soft stop of the main engine.

4. The cylinder pressurization method is adopted, and the closed-loop control of the pressure is realized through the control of the electric proportional valve, which ensures extremely high pressure application accuracy and stability.

5. The Vacuum chuck is driven by a servo motor to ensure the uniformity of polishing at each station on the premise of ensuring the polishing rate of the product.

6.Both the polishing plate and the upper pressure plate are equipped with cooling water cooling function.It  ensures  the  maximum  efficiency  of  the   polishing   liquid  and  reduces  the deformation of the polishing disc surface.

7.The equipment is equipped with a Lap plate correction device, and the flatness range of the plate surface after correction is 0.005-0.008mm.

Main Technical Parameters:

Model

TY-7104XA

TY-8104XA

TY-9104XA

Specification Of Plate

700x250x12mm

810x255x12mm

910x250x12mm

Ceramic Plate Diameter

240~260mm

305mm

360mm

Main Motor Power

5.5KW/380V

7.5KW/380V

7.5KW/380V

Pressure Plate Motor Power

0.4KW/380Vx4

0.4KW/380Vx4

0.4KW/380Vx4

Correction Device Motor Power

0.2KW/380V

0.2KW/380V

0.2KW/380V

Main Motor Speed

10-100rpm(max)

5-90rpm(max)

5-90rpm(max)

Workstation

4个

4个

4个

Modify Grinding Plate Mode

Automatic correction

Automatic correction

Automatic correction

Overall Dimensions

1050x1950x2300mm

1200x2200x2500mm

1200x1800x2300mm

Weight

2100KG

2350KG

2500KG

Inquiry
Contact Us
Contact person: Grace
Phone: +86 13622378685
Email: Grace@lapping-machine.com
Address:Building 34, Zone B, Yuanshan Industrial Zone, Xiangcheng Road, Guangming District, Shenzhen,China

Scan WeChat

Shenzhen Tengyu Grinding Technology Co., Ltd.