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Wafer thinning machine, arrange shipment!
2024-01-301445
Wafer thinning machine, arrange shipment!
This equipment is mainly used for thinning crystal materials such as silicon wafers, ceramics, germanium wafers, gallium arsenide, lithium niobate, quartz glass, etc

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Contact Us
Contact person: Grace
Phone: +86 13622378685
Email: Grace@lapping-machine.com
Address:Building 34, Zone B, Yuanshan Industrial Zone, Xiangcheng Road, Guangming District, Shenzhen,China

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Shenzhen Tengyu Grinding Technology Co., Ltd.