Home
Products
Wafer Grinder
CMP Polishing Machine
Lapping Machine
Edge Grinding Machine
Polishing Machine
Double-Side Lapping Machine
Optical Thin Film Coater
Applications
Video
About
Introduction
Factory
Honor
News
Company News
Industry News
Contact
English
русский
한국어
Deutsch
español
italiano
العَرَبِيَّة
language
English
русский
한국어
Deutsch
español
italiano
العَرَبِيَّة
search
search
News
Company News
Company News
Industry News
Wafer thinning machine, arrange shipment!
2024-01-30
1445
Wafer thinning machine, arrange shipment!
This equipment is mainly used for thinning crystal materials such as silicon wafers, ceramics, germanium wafers, gallium arsenide, lithium niobate, quartz glass, etc
Next:FD9104PA Ceramic Substrate Polishing Machine Exported to South Korea
2024-01-24
FD9104PA Ceramic Substrate Polishing Machine Exported to South Korea
Products
Wafer Grinder
CMP Polishing Machine
Lapping Machine
Edge Grinding Machine
Polishing Machine
Double-Side Lapping Machine
Optical Thin Film Coater
Applications
Applications
About
Introduction
Factory
Honor
News
Company News
Industry News
Contact Us
Contact person: Grace
Phone: +86 13622378685
Email: Grace@lapping-machine.com
Address:Building 34, Zone B, Yuanshan Industrial Zone, Xiangcheng Road, Guangming District, Shenzhen,China
Scan WeChat
Shenzhen Tengyu Grinding Technology Co., Ltd.