Automatic Edge Grinding Machine-Shenzhen Tengyu Grinding Technology Co., Ltd.

Product Details

Equipment Characteristics:

1. The machine can chamfer 6/8 inch wafer.

2. Two wafers can be chamfered at the same time, and rough grinding and fine grinding can be realized by one key.

3. The design is equipped with five 6-inch and 8-inch Cassette box.

4. It has the function of automatic cleaning and drying, so that the dry in and dry out can be achieved.

5. All processes are fully automatic, and each step is handled by a manipulator.

6. The calibration and measurement of wafer are completed by CCD visual positioning. The diameter, of edge, center distance and size measurement of wafer before and after trimming are automatically completed by CCD visual matching program algorithm.

Technical Specifications:

Grinding wheel stroke	100mm	CCD positioning pixel accuracy	2.5 μm
Fast feed speed of grinding wheel	10 mm/s	Handling X-axis travel	1350mm
Minimum motion resolution of grinding wheel	0.5μm	Repeat positioning accuracy of each axis	2 μm
Diameter of main grinding wheel	202 mm	End face runout of grinding platform	5μm
Thickness measurement resolution	0.1μm	Concentricity of product and grinding table	±3μm
Clamping table type	Porous sucker	Vacuum limit pressure	-90 KPa
Wafer clamping mode	by suction	Chamfer accuracy	±20μm(Condition: grinding wheel angle 45°,TTV±10μm)
Bearing plate spindle speed	0~35rpm	Wafer roundness control capability	<10μm
Suction cup cleaning method	Bench air recoil	Angle control capability	+/-0.1°
Wafer processing flow	Same box process	Power	380V-15kW
water cleaning	Cleaning and drying through water air two fluid nozzle	Weight	≈2000kg
Wafer positioning mode	3 CCD visual positioning centers and straight edges	Overall dimensions	2295x1275x2000mm