Products
  • Small Lapping&Polishing Machine
  • Small Lapping&Polishing Machine
  • Small Lapping&Polishing Machine
  • Small Lapping&Polishing Machine
  • Small Lapping&Polishing Machine
  • Small Lapping&Polishing Machine
  • Small Lapping&Polishing Machine
  • Small Lapping&Polishing Machine
  • Small Lapping&Polishing Machine
  • Small Lapping&Polishing Machine
  • Small Lapping&Polishing Machine
  • Small Lapping&Polishing Machine
  • Small Lapping&Polishing Machine
  • Small Lapping&Polishing Machine
  • Small Lapping&Polishing Machine
  • Small Lapping&Polishing Machine
  • Small Lapping&Polishing Machine
  • Small Lapping&Polishing Machine
Small Lapping&Polishing Machine

Main purposes:

It is widely used for single-sided Lapping and polishing of LED sapphire substrates, Optical Glass Wafers, Quartz Wafers, Silicon Wafers, Germanium wafers, Silicon carbide, sealing ring, Optical Cutting Valve Sheets, Hydraulic Compaction, Stainless Steel, Titanium Alloy, copper, aluminum alloy,Cemented Carbide, Tungsten Steel and other materials.

Product Details
Working Principle:

1.This is a high precision surface grinder. It can grind a piece by following steps: we fasten it on the Lap plate and add pressure by putting weights on the piece. Then, we can grind the working piece through its relative friction with the Lap plate.

2.The Lapping plate correction device is moved back and forth by hydraulic suspension guides. The sheet surface is precision machined with diamond tools to achieve high flatness.

(Advantages:

1. The lapping plate can always maintain a high flatness, thereby ensuring the flatness of the workpiece;

2.Increased stock removal rate;

3.Improved lapping performance stability;

4.Reduce the amount of slurry used.)

Characteristics:

1.The interval type automatic spraying device is adopted, Spray time and flow can be set as needed.

2.The flatness of the Lap plate : ≤0.002mm.

3.Adjust the pressure by increasing or decreasing the weight of the weights.

4.The equipment adopts an on-off button to control system, the time and speed of the Lap plate can be set on the control panel.

5.This equipment is equipped with a Lap plate correction device, which is mainly used to correct the flatness of the Lap plate and evenly groove the Lap plate. The flatness of the corrected Lap plate can be up to 0.002mm, which plays a very critical role in the grinding of the product, and the flatness of workpiece after processing can reach 0.0005mm(φ10mm)(Note:Different materials can achieve different accuracy, and this data can not be used for all products.).

Main Technical Parameters:

Model

TY-15LP

TY-18LP

TY-24LPQ

Lap Plate Size

380x120x13mm

460x140x12mm

610x160x12mm

Maximum Workpiece Size

φ180mm

φ220mm

φ270mm

Main Motor Power

0.75KW

1.5KW

2.2KW

Main Power Supply

3Phase 380V/1Phase 220V

3Phase 380V/1Phase 220V

3Phase 380V/1Phase 220V

Shaving Machine Power

0.2KW

0.2KW

0.2KW

Main Motor Speed

0-140RPM

0-140RPM

0-140RPM

Speed of Correction

0-120mm/min

0-120mm/min

0-120mm/min

Flatness

1um

1um

2um

Time Range

99小时59分

99小时59分

99小时59分

Cylinder

/

/

Total Working Pressure

/

/

0.4-0.6mpa

Work Station

1-3PCS

1-3PCS

1-3PCS

Weight

≈350kg

≈750kg

≈850kg

Overall Dimensions

850x1250x1350mm

1450x1150x1300mm

1600x1100x2000mm

Inquiry
Contact Us
Contact person: Grace
Phone: +86 13622378685
Email: Grace@lapping-machine.com
Address:Building 34, Zone B, Yuanshan Industrial Zone, Xiangcheng Road, Guangming District, Shenzhen,China

Scan WeChat

Shenzhen Tengyu Grinding Technology Co., Ltd.