Products
  • CMP Polishing Machine
  • CMP Polishing Machine
  • CMP Polishing Machine
  • CMP Polishing Machine
  • CMP Polishing Machine
  • CMP Polishing Machine
  • CMP Polishing Machine
  • CMP Polishing Machine
  • CMP Polishing Machine
  • CMP Polishing Machine
  • CMP Polishing Machine
  • CMP Polishing Machine
  • CMP Polishing Machine
  • CMP Polishing Machine
CMP Polishing Machine

What the Polishing machines can do?

It is used for:

• 3,4,6,8-inch silicon wafer

• Sapphire substrate/wafer

• Tungsten carbide parts

• Ceramic parts

• Valves

• crystal glass

• Silicon carbide wafer

Product Details
What are the advantages of the machine?

1.  This is a single-side precision polishing equipment. It adopts advanced mechanical   structure and control method, and has high polishing efficiency and stable operation.

2.  The whole machine adopts PLC+touch screen control system, Equipment parameters can be set here, which is easy to operate.

3.  The main  motor adopts variable frequency speed control to realize the soft start and soft stop of the main engine.

4.  The cylinder pressurization method is adopted, and the closed-loop control of the pressure  is  realized  through  the  control  of  the  electric  proportional valve,  which ensures extremely high pressure application accuracy and stability.

5.  The Vacuum chuck is driven by a servo motor to ensure the uniformity of polishing at each station on the premise of ensuring the polishing rate of the product.

6.  Both the polishing plate and the upper pressure plate are equipped with cooling water cooling function.

7.  It  ensures  the  maximum  efficiency  of  the   polishing   liquid  and  reduces  the deformation of the polishing disc surface.

Technical Specifications:

Model

TY-7104PA

TY-8104PA

TY-9104PA

Lap Plate Diameter

Φ700mm

810mm

910mm

Block size

Φ260mm

Φ305mm

Φ360mm

Suitable Wafer Size

3,4,6,8inch

4,6,8,12inch

6,8,12inch

Plate cooling

Cooling water jacket

Cooling water jacket

Cooling water jacket

P. Plate

4 axles.
(driving force system
individually)

4 axles.
(driving force system
individually)

4 axles.
(driving force system
individually)

Applied pressure

By cylinder

By cylinder

By cylinder

Pressure range

30~150kg

30~150kg

30~150kg

Plate Speed

5~80rpm

5~80rpm

5~80rpm

Power of Main Motor

4KW /AC380V, 3Phase, 60Hz

7.5KW//AC380V, 3Phase, 60Hz

7.5KW//AC380V, 3Phase, 60Hz

Pneumatic

0.5~0.8 Mpa

0.5~0.8 Mpa

0.6~0.8 Mpa

Overall Dimensions

1200*1700*2300mm

≈1150x1050x2200mm

≈1250x1150x2200mm

Weight

2500kg

2800KG

2350KG

Controller

Touch Screen (Proface)

Touch Screen (Proface)

Touch Screen (Proface)

Inquiry
Contact Us
Contact person: Grace
Phone: +86 13622378685
Email: Grace@lapping-machine.com
Address:Building 34, Zone B, Yuanshan Industrial Zone, Xiangcheng Road, Guangming District, Shenzhen,China

Scan WeChat

Shenzhen Tengyu Grinding Technology Co., Ltd.