Semi-Automatic Wafer Grinder

Applies to: wafer grinding or back-thinning of advanced materials, such as:SiC,GaAs,Sapphire,Si,GaN,InP.• Ultra-precision optical components, such as：ULE glass,High-energy particle scintillator,Fluore……

Automatic wafer Grinder

Main purpose:This equipment is mainly used for grinding Si Ge、GaAs、InP、SiC、GaN、ZnO、LiTaO3、 Semiconductor materials such as quartz glass and diamond.

Dual Spindle Wafer Grinder

Features:The outline and load-bearing structure adopt our latest cast iron frame, marble platform and support structure, and the support of the grinding wheel spindle is made of sand casting. Compared……