CMP Lapping Machine

Application Scope：This equipment is mainly used for single-sided precision grinding of sapphire substrate, sapphire epitaxial wafer, Si, ceramic wafer, quartz crystal, SiC, Ge and other semiconductor ……

CMP Polishing Machine

What the Polishing machines can do? It is used for: • 3,4,6,8-inch silicon wafer • Sapphire substrate/wafer • Tungsten carbide parts • Ceramic parts • Valves • crystal glass • Silicon carbide ……