Home
Products
Wafer Grinder
CMP Polishing Machine
Lapping Machine
Edge Grinding Machine
Polishing Machine
Double-Side Lapping Machine
Optical Thin Film Coater
Applications
Video
About
Introduction
Factory
Honor
News
Company News
Industry News
Contact
English
русский
한국어
Deutsch
español
italiano
العَرَبِيَّة
language
English
русский
한국어
Deutsch
español
italiano
العَرَبِيَّة
search
search
Products
Edge Grinding Machine
Wafer Grinder
CMP Polishing Machine
Lapping Machine
Edge Grinding Machine
Polishing Machine
Double-Side Lapping Machine
Optical Thin Film Coater
Automatic Edge Grinding Machine
Main Purposes:It is mainly used for silicon, sapphire, silicon carbide, gallium arsenide and other semiconductor materials; High precision double chamfering and edging of various polycrystalline or fl……
Learn More
Products
Wafer Grinder
CMP Polishing Machine
Lapping Machine
Edge Grinding Machine
Polishing Machine
Double-Side Lapping Machine
Optical Thin Film Coater
Applications
Applications
About
Introduction
Factory
Honor
News
Company News
Industry News
Contact Us
Contact person: Grace
Phone: +86 13622378685
Email: Grace@lapping-machine.com
Address:Building 34, Zone B, Yuanshan Industrial Zone, Xiangcheng Road, Guangming District, Shenzhen,China
Scan WeChat
Shenzhen Tengyu Grinding Technology Co., Ltd.