Home
Products
Wafer Grinder
CMP Polishing Machine
Lapping Machine
Edge Grinding Machine
Polishing Machine
Double-Side Lapping Machine
Optical Thin Film Coater
Applications
Video
About
Introduction
Factory
Honor
News
Company News
Industry News
Contact
English
русский
한국어
Deutsch
español
italiano
العَرَبِيَّة
language
English
русский
한국어
Deutsch
español
italiano
العَرَبِيَّة
search
search
Products
Lapping Machine
Wafer Grinder
CMP Polishing Machine
Lapping Machine
Edge Grinding Machine
Polishing Machine
Double-Side Lapping Machine
Optical Thin Film Coater
Small Lapping&Polishing Machine
Main purposes:It is widely used for single-sided Lapping and polishing of LED sapphire substrates, Optical Glass Wafers, Quartz Wafers, Silicon Wafers, Germanium wafers, Silicon carbide, sealing ring,……
Learn More
Large Lapping&Polishing Machine
Main purposes:It is widely used for single-sided lapping&polishing of optical Stainless steel, bearing steel, stainless iron, hard alloy, aluminum alloy, diamond, glass, ceramics, valve plate, sealing……
Learn More
Products
Wafer Grinder
CMP Polishing Machine
Lapping Machine
Edge Grinding Machine
Polishing Machine
Double-Side Lapping Machine
Optical Thin Film Coater
Applications
Applications
About
Introduction
Factory
Honor
News
Company News
Industry News
Contact Us
Contact person: Grace
Phone: +86 13622378685
Email: Grace@lapping-machine.com
Address:Building 34, Zone B, Yuanshan Industrial Zone, Xiangcheng Road, Guangming District, Shenzhen,China
Scan WeChat
Shenzhen Tengyu Grinding Technology Co., Ltd.
English
русский
한국어
Deutsch
español
italiano
العَرَبِيَّة