Home
Products
Wafer Grinder
CMP Polishing Machine
Lapping Machine
Edge Grinding Machine
Polishing Machine
Double-Side Lapping Machine
Optical Thin Film Coater
Applications
Video
About
Introduction
Factory
Honor
News
Company News
Industry News
Contact
English
русский
한국어
Deutsch
español
italiano
العَرَبِيَّة
language
English
русский
한국어
Deutsch
español
italiano
العَرَبِيَّة
search
search
Products
Polishing Machine
Wafer Grinder
CMP Polishing Machine
Lapping Machine
Edge Grinding Machine
Polishing Machine
Double-Side Lapping Machine
Optical Thin Film Coater
Small Polishing Machine
Main purposes:It is suitable for single-sided polishing of various high-precision workpieces. Such as aluminum alloy, stainless steel, tungsten steel, graphite, ceramics, silicon wafer, sapphire, valv……
Learn More
Large Polishing Machine
Main purposes:It is suitable for single-sided polishing of various high-precision large and small workpieces. Such as aluminum alloy, stainless steel, tungsten steel, light guide plate, optical glass,……
Learn More
Products
Wafer Grinder
CMP Polishing Machine
Lapping Machine
Edge Grinding Machine
Polishing Machine
Double-Side Lapping Machine
Optical Thin Film Coater
Applications
Applications
About
Introduction
Factory
Honor
News
Company News
Industry News
Contact Us
Contact person: Grace
Phone: +86 13622378685
Email: Grace@lapping-machine.com
Address:Building 34, Zone B, Yuanshan Industrial Zone, Xiangcheng Road, Guangming District, Shenzhen,China
Scan WeChat
Shenzhen Tengyu Grinding Technology Co., Ltd.
English
русский
한국어
Deutsch
español
italiano
العَرَبِيَّة