Semi-Automatic Wafer Grinder-Shenzhen Tengyu Grinding Technology Co., Ltd.

Product Details

Uses:

Wafer Grinder can be used to quickly thin the product, improve the surface quality of the product, and increase the flatness and parallelism,and can effectively control the thickness, can achieve a higher thickness tolerance.

Equipment composition:

Vacuum chuck,Aerostatic spindle,Drive mechanism,grinding wheel,Feeding mechanism,Fully closed loop control system,etc.

Way to control:

1、This machine adopts advanced international well-known brand PLC and touch screen, with high degree of automation, realizes man-machine interface, and the operation is simple and clear at a glance.

2、Air pressure detection sensor, when the air pressure is lower than the minimum pressure set by the equipment for normal processing, the equipment will alarm to prevent the workpiece from being sucked firmly.

3、Grinding wheel torque control, when the torque is higher than the torque generated by the normal processing set by the equipment, the equipment will alarm to prevent the machine parts from being damaged by the tool when the equipment is abnormal or misoperation.

4、The grinding wheel current monitoring, when the cold grinding wheel is higher than the maximum current generated by the normal processing set by the equipment, the grinding wheel rebounds, and the rebound distance can be adjusted to prevent the grinding wheel from squeezing the workpiece and causing damage.

5、The automatic compensation of the wear of the grinding wheel prevents the consumption of the grinding wheel while grinding the product from affecting the processing accuracy of the workpiece.

Optional additional items：

1、Automatic grinding wheel online dressing

2、Online thickness measurement system

（Notice：If you need to install the above two items, please put forward before purchasing the equipment.）

Advantages

The thickness of the 4/6 inch silicone wafer can be reduced to 80um thick without breaking.

Technical Parameter：

Model	TY-GD6	TY-GD8	TY-GD12	TY-GD22
Maximum processing size	Φ150	Φ200	Φ300	Φ550
Wheel speed	0-3000rpm/min	0-3000rpm/min	0-3000rpm/min	0-3000rpm/min
Wheel motor power	5.5kw	5.5kw	5.5kw	5.5kw
Sucker speed	0-300rpm/min	0-300rpm/min	0-300rpm/min	0-300rpm/min
Sucker power	1.5KW 380V/220V	1.5KW 380V/220V	1.5KW 380V/220V	1.5KW 380V/220V
Grating control system	Resolution： 0.001mm	Resolution： 0.001mm	Resolution： 0.001mm	Resolution： 0.001mm
TTV	≤2um(4 inch)	≤2um(4 inch)	≤2um(4 inch)	≤2um(4 inch)
Thickness tolerance	≤2um(4 inch)	≤2um(4 inch)	≤±3um(4 inch)	≤±3um(4 inch)
Minimum thickness	≤100um	≤100um	≤100um	≤100um(8inch)
Minimum setting step of grinding wheel	0.1um/s	0.1um/s	0.1um/s	0.1um/s
Water tank size	780480550mm	780480550mm	780480550mm	780480550mm
Equipment size	101012102070mm	101012102070mm	101012102070mm	101012102070mm
weight	1200KG	1200KG	1200KG	1200KG

Product Video

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