Main purpose:
This equipment is mainly used for grinding Si Ge、GaAs、InP、SiC、GaN、ZnO、LiTaO3、 Semiconductor materials such as quartz glass and diamond.
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Equipment features:
1. This series of equipment is a fully automatic wafer grinding machine independently designed and manufactured by our company. The technology is mature, the performance is stable, and it can completely replace imported brands.
2. Advanced processing systems and design features contribute to achieving high yield and yield.
3. Standard contact online thickness measurement. Non contact NCG is also optional.
4. Adopting an LCD touch screen graphical user interface makes operation and maintenance more intuitive and simple.
5. Breaking through the blockade of core technology, self-developed high-power static pressure air floating spindle and load-bearing platform.
6. The use of marble base and marble air floating turntable greatly improves the overall stability of the equipment.
7. Can grind various wafers ranging from 3 to 12 inches.
Main technical parameters:
|
Model |
GD2005A |
GD3005A |
|
Wafer sizes |
4",6",8" |
8",12" |
|
Grinding method |
In-feed grinding with wafer Rotation |
In-feed grinding with wafer Rotation |
|
Grinding Wheel |
Diamond Wheel |
Diamond Wheel |
|
Rated power |
7.5kw |
11KW |
|
Rated speed |
1000-7000 |
1000-4000 |
|
TTV |
≤2um |
≤3um |
|
Roughness |
customizable |
customizable |
|
Thickness measurement accuracy |
1um |
1um |
|
Dimensions (WxDxH) |
2500x4500x1800mm |
2500x4500x1800mm |
|
weight |
≈4000kg |
≈5000kg |
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